· Rapid dynamic processes and fault transients in micro-devices (captured using high-speed cameras).
· Full-field deformation and strain distribution of micro-devices and structures under load or thermal stress (measured using Digital Image Correlation (DIC) systems).
· Deviations from the predetermined motion or frictional collisions during the process of a pick-and-place machine grabbing, adsorbing, and translating chips (captured using high-speed cameras).
· Full-field strain and deformation distribution of the phone body and screen during impact in drop testing (measured using Digital Image Correlation (DIC) systems).
· Millisecond-level touch response and transient screen displacement (captured using high-speed cameras).
· Transient flow velocity and turbulence distribution in chip microchannel flow field (measured using microscopic Particle Image Velocimetry (PIV) systems).
