· Real dynamic response of materials and structures under transient loads such as impact, fracture, and vibration (captured using high-speed cameras).
· Real deformation mechanisms of materials and structures under static, cyclic, impact, and complex coupled loads (measured using Digital Image Correlation (DIC) systems).
· Local deformation and stress distribution of materials under tensile, compressive, bending, and other loads (measured using Digital Image Correlation (DIC) systems)
· Precise reconstruction of structural vibration response, modal parameters, and multi-order mode shapes (measured using Digital Image Correlation (DIC) systems).
· Strain distribution and temperature field evolution of materials under high-temperature and thermo-mechanical coupled loads (measured using High-Temperature Digital Image Correlation (DIC) systems).
· Local deformation and stress distribution of millimeter-scale micro-materials under tensile, compressive, or bending loads (measured using Micro Digital Image Correlation (DIC) systems).
