The Xiaomi drop test demonstrates how high-speed visual measurement can capture both whole-device motion and local deformation during a millisecond-scale impact. A high speed camera preserves the complete drop sequence, while motion analysis extracts displacement, velocity, acceleration, and impact attitude to verify the actual test condition.
Digital image correlation measurement further reveals localized deformation and strain distribution that cannot be obtained from motion tracking alone. By comparing measured deformation with finite element simulation results, the system provides quantitative evidence for validating structural response, impact behavior, and drop-test models in consumer electronics and other precision engineering applications.
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