Xiaomi Hotspot Pivot demonstrates how a high speed camera combined with 3D Digital Image Correlation (DIC) technology can capture and analyze micro-deformation in complex mechanical structures. During the folding phone shaft strain and displacement test, the high-speed imaging system records subtle structural responses.
Digital image correlation analysis provides full-field 3D deformation measurement, strain distribution, and displacement visualization. This integrated optical measurement solution enables researchers and engineers to observe real-time deformation behavior that is difficult to detect with conventional methods, supporting precise evaluation of advanced products and engineering structures.
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